Orlando, 06 June, 2025 - intoPIX, a pioneering provider of low-latency, lightweight AV-over-IP compression solutions, is thrilled to continue its collaboration with Nextera Video and Adeas, showcasing the latest FPGA developments of the JPEG XS TDC solutions tailored for IPMX and ST 2110. This exhibit will feature integration with Nextera-Adeas’ industry-leading IPMX/ST 2110 cores targeted at AMD Zynq™ 7000 series SoCs and modules and is set to take place at the upcoming Infocomm Show in Orlando.
intoPIX's new JPEG XS RTP video subsystem IP core enables the use of the most advanced JPEG XS codec, including the common JPEG XS profile and the new JPEG XS TDC profile for flawless imaging, offering up to twice the compression efficiency. The IP subsystem includes the TicoXS FIP core, SMPTE 2110-22 core, AES encryption core to interface directly with the Nextera-Adeas IPMX/ST 2110 solutions.
Nextera-Adeas has implemented two new key features, NMOS IS-11 (Stream Compatibility Management) and Privacy Encryption Protocol (PEP), into their IPMX core solution. NMOS IS-11 ensures compatibility between senders and receivers, and PEP provides an extra level of security for IPMX devices.
The joint demo design supports high-quality secure 4Kp60 HDMI to/from 1G Ethernet, and the FPGA footprint is small enough to fit into compact, cost-effective families such as AMD Zynq 7030 SoCs.
"Demonstrating the integration of IPMX and JPEG XS into smaller, cost-optimized products such as the AMD Zynq 7000 SoC means that AV companies can keep costs down while maintaining broadcast-quality functionality," said Ramesh Iyer, Senior Director of Pro AV, Broadcast & Consumer at AMD.
“The Nextera-Adeas solution integrated with intoPIX JPEG XS provides everything needed to help OEMs IPMX-Enable their new or existing products quickly and easily,” said Jed Deame, CEO of Nextera Video.
“This initiative is set to greatly accelerate IPMX and TicoXS FIP integration, bringing improved efficiency and performance to our valued OEM customers on AMD FPGAs," explains Jean-Baptiste Lorent, Head of ProAV Group, intoPIX.
"ST2110/IPMX 코어와 함께 PEP 보안과 intoPIX 최신 TicoXS FIP 코어의 통합을 발표하게 되어 기쁘게 생각합니다." Adeas의 전무이사 앙투안 위즐라스는 설명합니다.
intoPIX와 Nextera, Adeas는 Infocomm 2025에서 AMD FPGA 기반 공동 레퍼런스 디자인을 선보일 예정입니다. intoPIX 부스 2761번과 Adeas/Nextera 부스 3089번을 방문하여 새로운 디자인을 만나보세요.
관련 콘텐츠
Meet us at InfoComm 2025 to discover our live demo - Booth 2761
Meet us at InfoComm 2025 to discover our live demo - Booth 2761
Learn more about the JEPG XS TDC Profile technology
Learn more about the JEPG XS TDC Profile technology
